Application process of laser cutting machine

1. Fix the raw materials that must be cut on the equipment table of the Laser Cutting Machine.

2. According to the material and thickness of the metal plate, adjust the basic parameters of the equipment accordingly.

3. Select suitable glasses and nozzles, and carry out pre-start inspections to check their integrity and cleaning conditions.

4. Adjust the cutting head to a suitable focus position according to the cutting thickness and cutting regulations.

5. Select the appropriate cutting gas and check whether the gas ejection condition is good.

6. Try to cut the raw material. After cutting the material, check the vertical viewing angle of the cross section, the surface roughness and whether there is burr or slag.

7. Analyze the cross section and adjust the basic cutting parameters accordingly until the sample cross section fabrication process meets the requirements.

8. Carry out the program programming of the construction drawings of the commodity workpieces and the design and layout of the entire PCB circuit board cutting, and import them into the cutting system.

9. Adjust the interval between the cutting head and the focus point, prepare the gas in advance, and cut slowly.

10. Check the production process of the sample. If there is an abnormality, adjust the basic parameters immediately until the cutting meets the production process regulations.